Hardware & Analysis

PCB Simulation, Modelling, EMC and SI/PI Analysis

SI and PI analysis plays a critical role in maintaining signal quality integrity and power stability in high-speed electronic circuits. This evaluation process minimises the risk of performance issues and hardware failures.

Along with the thermal and SI/PI simulation, we provide electronic hardware modelling to reduce the project development time without impairing quality and ensure the long-term reliability of your PCBs and equipment.

Our Services

In the course of hardware development, we use the following types of PCB simulation and analysis:

3D Modelling

We employ 3D PCB modelling extensively for seamless integration with the enclosure.

Our 3D modelling services offer several compelling benefits, including:

Faster enclosure design (reduced cost and time)
Trouble spot detection at the early stages of the project
Use of ready-made models for hardware thermal and SI/PI analysis

Signal Integrity (SI) Analysis

When designing complex digital circuit boards with high-frequency interfaces, we use IBIS model-based signal integrity analysis.

This rigorous approach allows us to diagnose and eliminate parasitic capacitances and inductances of conductors, mutual induction of adjacent conductors, and circuit inconsistency.

By conducting SI simulation at the circuit development stage and during PCB design, we can proactively address potential SI issues, avoiding costly rework and ensuring optimal signal integrity throughout the product's lifecycle.

Electromagnetic Compatibility (EMC) Analysis

Checking the electromagnetic compatibility of the circuit board layout allows to:

Reduce the number of iterations
Reduce the time of certification and JTAG testing
Improve the electromagnetic compatibility of complex integrated devices

Thermal Simulation

Application areas:

High-current design of printed circuit boards
Assessment of the size and location of air vents in the enclosure of the designed device
Evaluation of heat sink or forced ventilation requirements in integrating the device with the enclosure.
Assessment of the effective area of heat sink or required air current under forced ventilation of the device in the enclosure

Outcomes:

Prevention device over-heating during long-term use within the range of working temperatures
Increased device reliability
Reduced design time and cost
Reduced expenses in warranty maintenance on client site

Power Integrity (PI) Analysis

Power Integrity (PI) Analysis is an important stage of electronics design to simulate the power distribution on the device.

The rising voltage requirements of modern microcircuits and the expanding use of PCBs present significant challenges in power distribution. The problem is aggravated by the reduced number of PCB layers and the use of BGA components with copper range perforation.

We analyse the power integrity in highly integrated and high-current devices. As a result of our PI analysis, you get: