High-Speed
PCB Design

High-Speed PCB Design

High-speed PCB manufacturing and design at Promwad are focused on producing printed circuit boards capable of handling rapid signal transmission and minimising signal integity issues. Employ our expertise in multi-layer, mixed-signal, and high-speed board design services from the block diagrams to all necessary documentation and manufacturing support.

Besides high-speed designs, we obtain full-fledged capabilities for hardware simulation & analysis: pre-layout and post-layout signal integrity, power integrity, thermal analysis, and EMC/EMI. Our advanced tools and experienced engineers ensure the seamless design and optimisation of high-performance electronic systems.

Design Procedure

Each project comprise a diverse set of offerings and services, but the overall high-speed PCB manufacturing procedure consists of:

Block diagram

Design specification

Library components review

Schematic design

Schematic review FW engineer

Components placement

Layer stack calculation

Pre-layout analysis

PCB routing

PCB layout review

Post-layout analysis

Design documentation development

Result: We take responsibility for each stage of the PCB manufacturing process, as well including handling challenges like reduced engineering time or increased complexity. We make sure you get the best quality design on time and budget.

Our Experience

Number of designs

PCIe – 6; FMC cards – 12; PCIe104 – 3; PXIe – 1; SoM – 7; RF – 3; mini-PCIe – 2

Interfaces

PCIe, 10GbE, 100GbE; CameraLink, MIPI, HDMI, DP; DDR4, JESD204b

Featured Case Study

Satellite modem design

We designed the device in a compact 1U form factor by dividing it into digital and analog boards. Our engineers have developed a dedicated front end using high-speed ADC/DAC converters and modern high-frequency analog modulators/demodulators. We reached high-speed data exchange between server and device with the help of four 10G interfaces and the DPDK framework. To configure the device and measure the signal parameters, we developed a graphic application.

Hardware Simulation and Analysis

We deliver high-speed PCB manufacturing solutions along with combined signal integrity, power integrity, thermal analysis, and EMI/EMC.

Signal Integrity (SI) Analysis

When designing complex digital circuit boards with high-frequency interfaces, we use IBIS model-based signal integrity analysis. The simulation takes place at the circuit development stage and during PCB design. Signal integrity approach allows us to diagnose and eliminate parasitic capacitances and inductances of conductors, mutual induction of adjacent conductors, and circuit inconsistency. For this purpose, we analyse the temporal characteristics, such as reflections, crosstalk, and others.

Power Integrity (PI) Analysis

PI analysis is an important stage of electronics development; it allows simulating power distribution on the PCB. We analyse power integrity in highly-integrated and high-current devices using DC Drop simulation, decoupling and plane noise analysis, and other methods. The outcome includes early problem detection before sample manufacturing, identification of lab-challenging issues, fewer design iterations, and increased hardware reliability.

Thermal

Thermal Simulation & Analysis

We conduct simulations to analyse various parameters, including board thermal behaviour and gradient, distribution, hot spot identiﬁcation, and more. The results include preventing device overheating during long-term use within various temperatures, enhancing device reliability; reducing engineering time and cost, and minimising on-site warranty maintenance expenses for clients.

EMC

Electromagnetic Compatibility (EMC) Analysis

Checking the electromagnetic compatibility of the circuit board layout enables us to reduce the iterations number and the certification testing time, and enhance the electromagnetic compatibility of complex integrated devices.

Design Output Options

By request of our customers, we provide preferable for them design documentation options:

PCB Manufacturing

Gerber and NC drill files
ODB++ (if needed)
IPC-D-356 file for electrical test
Drill drawing PDF-file

Assembly Manufacturing

BOM
Stensil apertures for solder paste
Component placement file
Assembly diagram for top and bottom layers
Shematic files

Our Hardware Development Projects

As a hardware development company, we have successfully completed numerous projects for a diverse range of industries, including telecommunications, automotive, and consumer electronics.