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High-Speed PCB Design for Multi-Gigabit Interfaces

At multi-gigabit rates, the board itself becomes part of the circuit. A via stub, a gap in a reference plane or the wrong stack-up can close a DDR5 eye or break a PCIe Gen5 link, and the problem often appears only on the first prototype.

Promwad's high-speed PCB design starts with architecture: topology, stack-up and impedance are defined before routing, and every critical net is checked in pre- and post-layout analysis. Your board reaches bring-up with its margins already confirmed.

What's Included

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Architecture and topology

Interface topology, clocking and termination are chosen with the SoC or FPGA vendor's guidelines and your mechanical limits in mind.

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Stack-up and impedance planning

Layer count, materials and trace geometry are calculated with Polar and agreed with your PCB supplier before layout.

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Constrained routing

Differential pairs, length and phase matching, via transitions and return-path control on every critical net.

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Power delivery for high-current devices

Plane design, decoupling and sequencing for SoCs, FPGAs and memory with tight rail tolerances.

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RF and mixed-signal sections

High-speed ADC/DAC front ends and RF paths placed and shielded next to fast digital logic.

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Pre- and post-layout analysis

SI and PI checks at schematic and layout stages. How we run SI / PI / thermal analysis →

Interfaces and Form Factors We Design With

The same interface expertise runs through all our hardware design services, from carrier boards to complete systems.

Memory

DDR4, DDR5

Serial links and networking

PCIe Gen4/Gen5, 10/25/100GbE, MGBE, JESD204B

Video and camera

12G-SDI, MIPI CSI-2, CameraLink, HDMI, DisplayPort,
eDP, LVDS

Form factors

PCIe cards, FMC (VITA 57.1), PCIe/104, PXIe, mini-PCIe, SoM and carrier boards, 1U systems

Our High-Speed Design Procedure

Twelve steps, with four review gates where a design does not move forward until it passes. 

  1. Block diagram 
  2. Design specification 
  3. Library components review 
  4. Schematic design 
  5. Gate 1: schematic review by a firmware engineer
  6. Component placement 
  7. Layer stack-up calculation 
  8. Gate 2: pre-layout analysis of critical interfaces
  9. PCB routing 
  10. Gate 3: PCB layout review against a high-speed checklist
  11. Gate 4: post-layout SI/PI analysis
  12. Design documentation 


We own every step, so a tight schedule or a late requirement change is handled inside the procedure. 

High-speed PCB design procedure

What You Receive

The full production package that comes with every Promwad PCB design project, plus the high-speed evidence behind it: 

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Stack-up and impedance report, agreed with your PCB supplier

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Routing constraints and length-matching reports per interface

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Pre- and post-layout SI/PI report with the margins found and the fixes applied

High-Speed PCB Case Studies

Hot-Swappable CFexpress Storage for FPGA Systems

Broadcasting · FMC HPC (VITA 57.1) · PCIe Gen3

Pain. Angelbird, a provider of high-performance storage media, needed fast local storage for FPGA-based broadcast and video systems. It had to be high-throughput and low-latency, take removable media for instant offload, and connect directly to leading FPGA platforms. 

Solution. We designed a CFexpress Type B storage board on the FMC HPC (VITA 57.1) standard. It runs two hot-swappable CFexpress Type B cards over PCIe Gen3 x2/x4 lanes, routed from the FMC connector to the card slots. 

Result. The board is in commercial use for 12K+ RAW and high-frame-rate recording in OB vans, DIT stations and field kits. It has since found use in industrial storage and rugged data logging, and grew into a line of FMC storage boards. 

Read the CFexpress storage board case →

CFexpress Storage Board for Broadcast FPGA Systems

Broadband SDR Satellite Modem in 1U

Telecom · AMD Zynq UltraScale+ · 4× 10G · High-speed ADC/DAC

Pain. A European developer of ground-segment satellite software wanted its own branded hardware platform for a satellite modem, with room to scale functionality later. 

Solution. We split the 1U device into a digital board on AMD Zynq UltraScale+ and an analog front-end board with high-speed ADC/DAC converters and high-frequency modulators and demodulators. Four 10G interfaces with DPDK carry data between the modem and the server. 

Result. A flexible platform: to extend the modem's functions, the client repurposes only the analog front-end board while the high-speed digital board stays unchanged. 

Read the SDR satellite modem design case →

Broadband software-defined radio satellite modem design

What Our Clients Say

They provided a fast and efficient way of communication

“Promwad completed the client's radio-electronic components research, schematics, schema, PCB design, and more. Their agile project management methodology impressed the client. The team was also flexible and has excellent leadership abilities.”

Mikalaj Murziankou
CEO, iomico (USA)
The amount of work they do is great for the amount of time they spend

“Promwad has done a great job of managing their part in our projects. We've done 20–25 purchase orders, and worked on several projects with them. […] Their main strength is that they offer all the skills we need, such as mechanical design, firmware and software development, PCB layout, and schematic generation.”

Neal Hartsough
Director of Sensors, Rapiscan Systems (USA)

Share Your Interface List and Constraints

Send us your block diagram, the high-speed interfaces on the board and your form-factor limits. Our engineers will come back with the risks they see and a proposed stack-up and design approach.

Tell us about your project

We’ll review it carefully and get back to you with the best technical approach.

All information you share stays private and secure — NDA available upon request.

Prefer direct email?
Write to info@promwad.com

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Plug-in model for your full-cycle R&D
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22 years of engineering expertise
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500+ projects for OEMs in EU & US
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MVP in 8–10 weeks — predictable delivery
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Featured at IBC, Embedded World, MWC

FAQ

When does a board need high-speed PCB design?

 

When signal edge rates make trace geometry part of the circuit. In practice that means DDR memory, PCIe, multi-gigabit Ethernet, SDI, MIPI or high-speed ADC/DAC links on the board.
 

How do you choose the layer count and materials?

 

We calculate the stack-up with Polar and agree it with your PCB supplier before layout. Standard FR4 is used wherever margins allow, and low-loss materials only on the layers that need them, which keeps unit cost down.
 

Can you fix a high-speed board that fails on the bench?

 

Yes. We review the design, run SI/PI analysis to find the root cause and define a targeted fix for the next revision, without restarting the project.
 

Do you work from SoC and FPGA vendor reference designs?

 

Yes. We start from the vendor's guidelines and reference designs for platforms such as AMD Zynq, NVIDIA Jetson and NXP i.MX, then adapt them to your form factor, I/O and thermal limits. NVIDIA carrier board design →
 

Can the same team handle FPGA and firmware for the board?

 

Yes. Our FPGA and embedded software engineers can take over bring-up, IP cores and drivers. If your team keeps the firmware in-house, we deliver the hardware with documented interfaces. FPGA & SoC design →