Top Embedded Hardware Trends for 2026: From RISC-V to Chiplets

Introduction: Embedded Hardware at the Edge of a New Era

As the demand for smarter, smaller, and more efficient devices grows across industries — from automotive to industrial automation and smart wearables — embedded hardware is undergoing a transformation. In 2026, several key trends will redefine how hardware platforms are designed, developed, and deployed.

In this article, we explore the top embedded hardware trends shaping the future of product development, including breakthroughs in processor architectures, advanced system integration, and edge AI acceleration.

1. The Rise of RISC-V: Open, Flexible, and Here to Stay

The RISC-V architecture has moved beyond academia and startups — it’s now being adopted by global OEMs and semiconductor giants for mainstream embedded applications.

Why RISC-V matters in 2026:

Open instruction set architecture (ISA) with no licensing fees
Custom extensions for application-specific acceleration
Growing ecosystem of toolchains, IP vendors, and silicon providers

Use cases:

Industrial automation controllers with deterministic behavior
Secure microcontrollers in medical and smart grid applications
AI-capable embedded platforms with custom vector extensions

Companies like SiFive, Andes, and Microchip are already shipping RISC-V cores tailored for embedded needs, while NXP, Intel, and Qualcomm are investing in next-gen RISC-V SoCs.

2. Chiplet-Based Design: A Modular Future for SoCs

Traditional SoCs (system-on-chips) are giving way to chiplet-based architectures, where individual functions (CPU, GPU, memory, I/O) are built as separate dies and integrated into a single package.

Benefits of chiplets:

Mix-and-match silicon for tailored designs
Shorter development cycles and lower NRE cost
Improved yield by fabricating smaller dies separately

In embedded systems, chiplets enable:

Tiered product offerings with shared IP blocks
Custom integration of analog, RF, and sensor functions
Easier upgrades without full silicon redesign

Standards like UCIe (Universal Chiplet Interconnect Express) are gaining traction to enable interoperability between chiplets from different vendors.

3. Heterogeneous Computing: Combining CPUs, GPUs, and AI Engines

In 2026, embedded platforms are no longer defined by a single processor. Heterogeneous computing — the seamless integration of general-purpose CPUs with domain-specific accelerators — is becoming the default.

Typical configurations:

Arm Cortex-A for Linux-based processing + Cortex-M for real-time control
Embedded GPUs for UI rendering + NPUs (Neural Processing Units) for AI
DSPs for audio/vision + FPGA blocks for flexible I/O or cryptography

This shift allows developers to:

Optimize for performance-per-watt
Partition workloads for latency or determinism
Consolidate multiple subsystems onto one board

Examples: NXP i.MX 95, TI Sitara AM67, Renesas RZ/V2L, Lattice Avant

4. Edge AI Acceleration: Purpose-Built Silicon for Local Inference

AI at the edge is no longer experimental. In 2026, embedded processors integrate AI accelerators natively to support applications like:

Predictive maintenance and anomaly detection
Vision-based object tracking and gesture control
Voice recognition and local decision-making

Trends in AI hardware:

Dedicated NPUs with 1–10 TOPS performance
INT8 quantized model support for low power
On-device model retraining for personalized AI

Frameworks like TensorFlow Lite, TVM, and Edge Impulse are now optimized for these platforms, enabling deployment of advanced models on devices with sub-1W power budgets.

5. Advanced Packaging and 3D Integration

With Moore’s Law slowing, hardware innovation now leans heavily on packaging technologies.

Techniques making impact in embedded:

System-in-Package (SiP): Multiple dies (MCU, memory, PMIC) in one package
Fan-Out Wafer-Level Packaging (FOWLP): For smaller footprint and better thermal properties
3D stacking: Vertical integration of memory and logic to save board space

These approaches allow for:

Higher density in wearables and edge AI modules
Better signal integrity for high-speed interfaces
Integration of heterogeneous functions (e.g., MCU + sensor die)

6. Silicon Lifecycle Management (SLM): Intelligence in the Chip

Embedded chips are now being designed with built-in lifecycle management features — enabling visibility into:

Temperature, voltage, aging metrics
Usage statistics and operational logs
Fault prediction and self-diagnostics

Benefits:

Improved reliability and proactive maintenance
Easier certification and compliance in regulated markets
Enhanced security and system monitoring

SLM IP is becoming standard in automotive-grade and industrial MCUs.

7. Security-by-Design: Hardware Root of Trust Becomes Mandatory

With connected devices proliferating, embedded hardware must incorporate strong security mechanisms from day one.

Security trends:

Secure boot with hardware-anchored keys
On-chip crypto engines (AES, RSA, ECC)
Physical Unclonable Functions (PUF) for identity
Secure debug and firmware update channels

In many industries — medical, energy, automotive — security certification (e.g., IEC 62443, UNECE R155) now mandates hardware-level security features.

Hardware Root of Trust Becomes Mandatory

8. Green Embedded Hardware: Efficiency and Sustainability

Energy efficiency and environmental impact are now key design constraints.

Developments driving greener hardware:

Ultra-low power MCUs with deep sleep <1µA
E-paper displays and efficient UI engines
Supply chain monitoring of critical materials
Hardware designed for recyclability and repairability

More OEMs are aligning with initiatives like the European Green Deal or Energy Star for IoT, making sustainability a competitive differentiator.

9. Globalization of Semiconductor Manufacturing

Geopolitical shifts and chip shortages have driven investment into localized semiconductor ecosystems:

U.S. CHIPS Act: incentives for domestic fabs and R&D
EU Chips Act: boosting EU-based design and production
India and Southeast Asia: rising EMS and foundry players

This decentralization opens new opportunities for embedded companies to:

Reduce supply chain risk
Build regional product variants
Align with ESG and regulatory goals

10. Design Toolchains and Dev Kits Keep Pace

The surge in hardware innovation is supported by evolving toolchains:

Toolchain trends:

Open-source EDA tools (KiCad, OpenROAD) getting enterprise-grade features
Cloud-based simulation and verification workflows
Dev kits with reference firmware, AI-ready demos, and test harnesses

Vendors now offer full SDKs targeting verticals — e.g., smart city, factory automation, healthcare — to shorten development time.

Final Thoughts: Strategic Investment in the Right Trends

The embedded hardware landscape in 2026 is defined by modularity, intelligence, and integration. From open architectures like RISC-V and chiplets to energy efficiency and built-in security, these trends aren’t just technical shifts — they represent competitive levers for product differentiation.

Promwad helps OEMs and startups turn these trends into real-world platforms — with hardware, firmware, and production support built around today’s demands.

Ready to align your roadmap with tomorrow’s embedded ecosystem? Let’s talk.