Power Integrity Analysis (PI) is an important stage of electronics design; it allows simulating power distribution on the PCB.
Present-day microcircuits use higher and higher voltage supply, the use of PCB and micro-circuits keeps growing – these factors make the task of power distribution quite difficult. The problem is aggravated by the reduced number of PCB layers and the use of BGA components with copper range perforation, which complicate power distribution on the PCB.
We analyze the power integrity in highly-integrated and high-current devices. Outcome:
- Improved power integrity by early problem detection before sample manufacturing
- Detection of problems that are difficult to diagnose in a lab environment
- Reduced number of design iterations
- Increased reliability of designed hardware